Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP
10.1016/j.microrel.2010.01.043
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2014
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sg-nus-scholar.10635-855912024-11-13T14:49:16Z Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP Su, Y.A. Tan, L.B. Tee, T.Y. Tan, V.B.C. MECHANICAL ENGINEERING 10.1016/j.microrel.2010.01.043 Microelectronics Reliability 50 4 564-576 MCRLA 2014-10-07T09:09:48Z 2014-10-07T09:09:48Z 2010-04 Article Su, Y.A., Tan, L.B., Tee, T.Y., Tan, V.B.C. (2010-04). Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectronics Reliability 50 (4) : 564-576. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2010.01.043 00262714 http://scholarbank.nus.edu.sg/handle/10635/85591 000277551500017 Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| description |
10.1016/j.microrel.2010.01.043 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Su, Y.A. Tan, L.B. Tee, T.Y. Tan, V.B.C. |
| format |
Article |
| author |
Su, Y.A. Tan, L.B. Tee, T.Y. Tan, V.B.C. |
| spellingShingle |
Su, Y.A. Tan, L.B. Tee, T.Y. Tan, V.B.C. Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP |
| author_sort |
Su, Y.A. |
| title |
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP |
| title_short |
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP |
| title_full |
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP |
| title_fullStr |
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP |
| title_full_unstemmed |
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP |
| title_sort |
rate-dependent properties of sn-ag-cu based lead-free solder joints for wlcsp |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85591 |
| _version_ |
1821225985801977856 |