A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages

A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages

10.1109/EPTC.2006.342719

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Bibliographic Details
Main Authors: Zhao, B., Tay, A.A.O., Prakash, T.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85855
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Institution: National University of Singapore
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Summary:10.1109/EPTC.2006.342719

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