A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages
10.1109/EPTC.2006.342719
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2014
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sg-nus-scholar.10635-858552015-01-13T19:33:40Z A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages Zhao, B. Tay, A.A.O. Prakash, T. MECHANICAL ENGINEERING 10.1109/EPTC.2006.342719 Proceedings of the Electronic Packaging Technology Conference, EPTC 220-226 2014-10-07T09:12:59Z 2014-10-07T09:12:59Z 2006 Conference Paper Zhao, B.,Tay, A.A.O.,Prakash, T. (2006). A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 220-226. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342719" target="_blank">https://doi.org/10.1109/EPTC.2006.342719</a> 142440665X http://scholarbank.nus.edu.sg/handle/10635/85855 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2006.342719 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Zhao, B. Tay, A.A.O. Prakash, T. |
| format |
Conference or Workshop Item |
| author |
Zhao, B. Tay, A.A.O. Prakash, T. |
| spellingShingle |
Zhao, B. Tay, A.A.O. Prakash, T. A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| author_sort |
Zhao, B. |
| title |
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| title_short |
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| title_full |
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| title_fullStr |
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| title_full_unstemmed |
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| title_sort |
hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85855 |
| _version_ |
1681089877080276992 |