A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages

A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages

Proceedings - Electronic Components and Technology Conference

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書目詳細資料
Main Authors:	Tay, A.A.O., Zhu, H.
其他作者:	MECHANICAL ENGINEERING
格式:	Conference or Workshop Item
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/85861
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

實物特徵
總結:	Proceedings - Electronic Components and Technology Conference