A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages
Proceedings - Electronic Components and Technology Conference
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2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85861 |
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sg-nus-scholar.10635-858612024-11-13T13:23:01Z A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages Tay, A.A.O. Zhu, H. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 199-204 PECCA 2014-10-07T09:13:03Z 2014-10-07T09:13:03Z 2002 Conference Paper Tay, A.A.O.,Zhu, H. (2002). A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages. Proceedings - Electronic Components and Technology Conference : 199-204. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/85861 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Proceedings - Electronic Components and Technology Conference |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Zhu, H. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. Zhu, H. |
| spellingShingle |
Tay, A.A.O. Zhu, H. A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| author_sort |
Tay, A.A.O. |
| title |
A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| title_short |
A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| title_full |
A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| title_fullStr |
A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| title_full_unstemmed |
A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| title_sort |
numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85861 |
| _version_ |
1821206832267395072 |