Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

Proceedings - Electronic Components and Technology Conference

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Main Authors:	Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85904
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85904
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spelling	sg-nus-scholar.10635-859042015-01-16T01:05:58Z Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1 196-200 PECCA 2014-10-07T09:13:33Z 2014-10-07T09:13:33Z 2005 Conference Paper Zhang, X.,Tee, T.Y.,Ng, H.S.,Teysseyre, J.,Loo, S.,Mhaisalkar, S.,Ng, F.K.,Lim, C.T.,Du, X.,Bool, E.,Zhu, W.,Chew, S. (2005). Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill. Proceedings - Electronic Components and Technology Conference 1 : 196-200. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/85904 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings - Electronic Components and Technology Conference
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S.
format	Conference or Workshop Item
author	Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S.
spellingShingle	Zhang, X. Tee, T.Y. Ng, H.S. Teysseyre, J. Loo, S. Mhaisalkar, S. Ng, F.K. Lim, C.T. Du, X. Bool, E. Zhu, W. Chew, S. Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
author_sort	Zhang, X.
title	Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
title_short	Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
title_full	Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
title_fullStr	Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
title_full_unstemmed	Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
title_sort	comprehensive hygro-thermo-mechanical modeling and testing of stacked die bga module with molded underfill
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85904
_version_	1681089885997367296

Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

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