Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
Proceedings - Electronic Components and Technology Conference
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Main Authors: | Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85904 |
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Institution: | National University of Singapore |
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