Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates

Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates

10.1115/IMECE2005-79456

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Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85919
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Institution: National University of Singapore
Description
Summary:10.1115/IMECE2005-79456

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