Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates
10.1115/IMECE2005-79456
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2014
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sg-nus-scholar.10635-859192015-01-31T13:18:37Z Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates Nai, S.M.L. Wei, J. Gupta, M. MECHANICAL ENGINEERING 10.1115/IMECE2005-79456 American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP 5 295-298 EEAEE 2014-10-07T09:13:44Z 2014-10-07T09:13:44Z 2005 Conference Paper Nai, S.M.L.,Wei, J.,Gupta, M. (2005). Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP 5 : 295-298. ScholarBank@NUS Repository. <a href="https://doi.org/10.1115/IMECE2005-79456" target="_blank">https://doi.org/10.1115/IMECE2005-79456</a> http://scholarbank.nus.edu.sg/handle/10635/85919 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
| description |
10.1115/IMECE2005-79456 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Nai, S.M.L. Wei, J. Gupta, M. |
| format |
Conference or Workshop Item |
| author |
Nai, S.M.L. Wei, J. Gupta, M. |
| spellingShingle |
Nai, S.M.L. Wei, J. Gupta, M. Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates |
| author_sort |
Nai, S.M.L. |
| title |
Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates |
| title_short |
Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates |
| title_full |
Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates |
| title_fullStr |
Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates |
| title_full_unstemmed |
Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates |
| title_sort |
development of advanced lead-free solder based interconnect materials containing nanosized y2o3 particulates |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85919 |
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1681089888738344960 |