Development of advanced lead-free solder based interconnect materials containing nanosized y2O3 particulates
10.1115/IMECE2005-79456
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Main Authors: | Nai, S.M.L., Wei, J., Gupta, M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85919 |
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Institution: | National University of Singapore |
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