Drop impact: Fundamentals & impact characterisation of solder joints
Proceedings - Electronic Components and Technology Conference
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2014
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sg-nus-scholar.10635-859282015-01-12T02:49:11Z Drop impact: Fundamentals & impact characterisation of solder joints Wong, E.H. Rajoo, R. Mai, Y.W. Seah, S.K.W. Tsai, K.T. Yap, L.M. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 2 1202-1209 PECCA 2014-10-07T09:13:50Z 2014-10-07T09:13:50Z 2005 Conference Paper Wong, E.H.,Rajoo, R.,Mai, Y.W.,Seah, S.K.W.,Tsai, K.T.,Yap, L.M. (2005). Drop impact: Fundamentals & impact characterisation of solder joints. Proceedings - Electronic Components and Technology Conference 2 : 1202-1209. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/85928 NOT_IN_WOS Scopus |
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Proceedings - Electronic Components and Technology Conference |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Wong, E.H. Rajoo, R. Mai, Y.W. Seah, S.K.W. Tsai, K.T. Yap, L.M. |
format |
Conference or Workshop Item |
author |
Wong, E.H. Rajoo, R. Mai, Y.W. Seah, S.K.W. Tsai, K.T. Yap, L.M. |
spellingShingle |
Wong, E.H. Rajoo, R. Mai, Y.W. Seah, S.K.W. Tsai, K.T. Yap, L.M. Drop impact: Fundamentals & impact characterisation of solder joints |
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Wong, E.H. |
title |
Drop impact: Fundamentals & impact characterisation of solder joints |
title_short |
Drop impact: Fundamentals & impact characterisation of solder joints |
title_full |
Drop impact: Fundamentals & impact characterisation of solder joints |
title_fullStr |
Drop impact: Fundamentals & impact characterisation of solder joints |
title_full_unstemmed |
Drop impact: Fundamentals & impact characterisation of solder joints |
title_sort |
drop impact: fundamentals & impact characterisation of solder joints |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/85928 |
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1681089890356297728 |