Drop impact: Fundamentals & impact characterisation of solder joints

Proceedings - Electronic Components and Technology Conference

Saved in:

Bibliographic Details
Main Authors:	Wong, E.H., Rajoo, R., Mai, Y.W., Seah, S.K.W., Tsai, K.T., Yap, L.M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85928
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

Be the first to leave a comment!

Similar Items