Drop impact: Fundamentals & impact characterisation of solder joints
Proceedings - Electronic Components and Technology Conference
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Main Authors: | Wong, E.H., Rajoo, R., Mai, Y.W., Seah, S.K.W., Tsai, K.T., Yap, L.M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85928 |
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Institution: | National University of Singapore |
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