Dynamic testing of solder joint strength under compression, tension and shearing

Dynamic testing of solder joint strength under compression, tension and shearing

10.1109/EPTC.2007.4469839

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Bibliographic Details
Main Authors: Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85933
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Institution: National University of Singapore
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Summary:10.1109/EPTC.2007.4469839

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