Dynamic testing of solder joint strength under compression, tension and shearing

• Main Authors: Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85933
• Institution: National University of Singapore

10.1109/EPTC.2007.4469839