Dynamic testing of solder joint strength under compression, tension and shearing
10.1109/EPTC.2007.4469839
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2014
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sg-nus-scholar.10635-859332023-10-30T22:16:06Z Dynamic testing of solder joint strength under compression, tension and shearing Liu, J.F. Shim, V.P.W. Tan, V.B.C. Lee, T.K. MECHANICAL ENGINEERING 10.1109/EPTC.2007.4469839 Proceedings of the Electronic Packaging Technology Conference, EPTC 380-385 2014-10-07T09:13:53Z 2014-10-07T09:13:53Z 2007 Conference Paper Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K. (2007). Dynamic testing of solder joint strength under compression, tension and shearing. Proceedings of the Electronic Packaging Technology Conference, EPTC : 380-385. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469839 1424413249 http://scholarbank.nus.edu.sg/handle/10635/85933 000253874600069 Scopus |
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10.1109/EPTC.2007.4469839 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Liu, J.F. Shim, V.P.W. Tan, V.B.C. Lee, T.K. |
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Conference or Workshop Item |
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Liu, J.F. Shim, V.P.W. Tan, V.B.C. Lee, T.K. |
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Liu, J.F. Shim, V.P.W. Tan, V.B.C. Lee, T.K. Dynamic testing of solder joint strength under compression, tension and shearing |
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Liu, J.F. |
title |
Dynamic testing of solder joint strength under compression, tension and shearing |
title_short |
Dynamic testing of solder joint strength under compression, tension and shearing |
title_full |
Dynamic testing of solder joint strength under compression, tension and shearing |
title_fullStr |
Dynamic testing of solder joint strength under compression, tension and shearing |
title_full_unstemmed |
Dynamic testing of solder joint strength under compression, tension and shearing |
title_sort |
dynamic testing of solder joint strength under compression, tension and shearing |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/85933 |
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1781784785675354112 |