Dynamic testing of solder joint strength under compression, tension and shearing

10.1109/EPTC.2007.4469839

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Bibliographic Details
Main Authors: Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85933
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-859332023-10-30T22:16:06Z Dynamic testing of solder joint strength under compression, tension and shearing Liu, J.F. Shim, V.P.W. Tan, V.B.C. Lee, T.K. MECHANICAL ENGINEERING 10.1109/EPTC.2007.4469839 Proceedings of the Electronic Packaging Technology Conference, EPTC 380-385 2014-10-07T09:13:53Z 2014-10-07T09:13:53Z 2007 Conference Paper Liu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K. (2007). Dynamic testing of solder joint strength under compression, tension and shearing. Proceedings of the Electronic Packaging Technology Conference, EPTC : 380-385. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469839 1424413249 http://scholarbank.nus.edu.sg/handle/10635/85933 000253874600069 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/EPTC.2007.4469839
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Liu, J.F.
Shim, V.P.W.
Tan, V.B.C.
Lee, T.K.
format Conference or Workshop Item
author Liu, J.F.
Shim, V.P.W.
Tan, V.B.C.
Lee, T.K.
spellingShingle Liu, J.F.
Shim, V.P.W.
Tan, V.B.C.
Lee, T.K.
Dynamic testing of solder joint strength under compression, tension and shearing
author_sort Liu, J.F.
title Dynamic testing of solder joint strength under compression, tension and shearing
title_short Dynamic testing of solder joint strength under compression, tension and shearing
title_full Dynamic testing of solder joint strength under compression, tension and shearing
title_fullStr Dynamic testing of solder joint strength under compression, tension and shearing
title_full_unstemmed Dynamic testing of solder joint strength under compression, tension and shearing
title_sort dynamic testing of solder joint strength under compression, tension and shearing
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85933
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