Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

10.1109/TMAG.2007.893801

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Bibliographic Details
Main Authors: Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Electrodeposition
MI
NiFe/Cu
Sputtering
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85943
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Institution: National University of Singapore
Description
Summary:10.1109/TMAG.2007.893801

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