Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

10.1109/TMAG.2007.893801

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Bibliographic Details
Main Authors: Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Electrodeposition
MI
NiFe/Cu
Sputtering
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85943
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Institution: National University of Singapore
id sg-nus-scholar.10635-85943
record_format dspace
spelling sg-nus-scholar.10635-859432023-10-26T09:05:21Z Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires Li, X.P. Yi, J.B. Seet, H.L. Yin, J.H. Thongmee, S. Ding, J. MATERIALS SCIENCE AND ENGINEERING MECHANICAL ENGINEERING Electrodeposition MI NiFe/Cu Sputtering 10.1109/TMAG.2007.893801 IEEE Transactions on Magnetics 43 6 2983-2985 IEMGA 2014-10-07T09:14:01Z 2014-10-07T09:14:01Z 2007-06 Conference Paper Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J. (2007-06). Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires. IEEE Transactions on Magnetics 43 (6) : 2983-2985. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893801 00189464 http://scholarbank.nus.edu.sg/handle/10635/85943 000246706200297 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Electrodeposition
MI
NiFe/Cu
Sputtering
spellingShingle Electrodeposition
MI
NiFe/Cu
Sputtering
Li, X.P.
Yi, J.B.
Seet, H.L.
Yin, J.H.
Thongmee, S.
Ding, J.
Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
description 10.1109/TMAG.2007.893801
author2 MATERIALS SCIENCE AND ENGINEERING
author_facet MATERIALS SCIENCE AND ENGINEERING
Li, X.P.
Yi, J.B.
Seet, H.L.
Yin, J.H.
Thongmee, S.
Ding, J.
format Conference or Workshop Item
author Li, X.P.
Yi, J.B.
Seet, H.L.
Yin, J.H.
Thongmee, S.
Ding, J.
author_sort Li, X.P.
title Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
title_short Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
title_full Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
title_fullStr Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
title_full_unstemmed Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
title_sort effect of sputtered seed layer on electrodeposited nife/cu composite wires
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85943
_version_ 1781784786538332160

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