Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

• Main Authors: Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J.
• Other Authors: MATERIALS SCIENCE AND ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Electrodeposition; MI; NiFe/Cu; Sputtering
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85943
• Institution: National University of Singapore

10.1109/TMAG.2007.893801