Rate dependent interface delamination in plastic IC packages

Rate dependent interface delamination in plastic IC packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

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Bibliographic Details
Main Authors: Tang, S., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86950
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Institution: National University of Singapore
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Summary:Proceedings of the Electronic Packaging Technology Conference, EPTC

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