Rate dependent interface delamination in plastic IC packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

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Bibliographic Details
Main Authors:	Tang, S., Guo, T.F., Cheng, L.
Other Authors:	MATERIALS SCIENCE AND ENGINEERING
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/86950
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-86950
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spelling	sg-nus-scholar.10635-869502021-10-04T09:24:53Z Rate dependent interface delamination in plastic IC packages Tang, S. Guo, T.F. Cheng, L. MATERIALS SCIENCE AND ENGINEERING MECHANICAL ENGINEERING Proceedings of the Electronic Packaging Technology Conference, EPTC 680-685 2014-10-07T09:56:42Z 2014-10-07T09:56:42Z 2007 Tang, S., Guo, T.F., Cheng, L. (2007). Rate dependent interface delamination in plastic IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 680-685. ScholarBank@NUS Repository. 1424413249 http://scholarbank.nus.edu.sg/handle/10635/86950 000253874600123 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings of the Electronic Packaging Technology Conference, EPTC
author2	MATERIALS SCIENCE AND ENGINEERING
author_facet	MATERIALS SCIENCE AND ENGINEERING Tang, S. Guo, T.F. Cheng, L.
author	Tang, S. Guo, T.F. Cheng, L.
spellingShingle	Tang, S. Guo, T.F. Cheng, L. Rate dependent interface delamination in plastic IC packages
author_sort	Tang, S.
title	Rate dependent interface delamination in plastic IC packages
title_short	Rate dependent interface delamination in plastic IC packages
title_full	Rate dependent interface delamination in plastic IC packages
title_fullStr	Rate dependent interface delamination in plastic IC packages
title_full_unstemmed	Rate dependent interface delamination in plastic IC packages
title_sort	rate dependent interface delamination in plastic ic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/86950
_version_	1713207735501193216

Rate dependent interface delamination in plastic IC packages

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