Exploring the water-soluble phosphine ligand as the environmentally friendly stabilizer for electroless nickel plating
10.1021/ie801456f
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Main Authors: | Wang, K., Hong, L., Liu, Z.-L. |
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Other Authors: | CHEMICAL & BIOMOLECULAR ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/88884 |
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Institution: | National University of Singapore |
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