Exploring the water-soluble phosphine ligand as the environmentally friendly stabilizer for electroless nickel plating

10.1021/ie801456f

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Bibliographic Details
Main Authors: Wang, K., Hong, L., Liu, Z.-L.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/88884
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Institution: National University of Singapore

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