Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

10.1016/S0169-4332(02)00473-7

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Bibliographic Details
Main Authors: Wang, W.C., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
4-Vinylpyridine
Adhesion
Copper
Electroless plating
Plasma polymerization
Polyimide
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91965
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Institution: National University of Singapore
Description
Summary:10.1016/S0169-4332(02)00473-7

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