Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
10.1016/S0169-4332(02)00473-7
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Main Authors: | Wang, W.C., Kang, E.T., Neoh, K.G. |
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Other Authors: | CHEMICAL & ENVIRONMENTAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/91965 |
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Institution: | National University of Singapore |
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