Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

10.1016/S0169-4332(02)00473-7

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Bibliographic Details
Main Authors:	Wang, W.C., Kang, E.T., Neoh, K.G.
Other Authors:	CHEMICAL & ENVIRONMENTAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	4-Vinylpyridine Adhesion Copper Electroless plating Plasma polymerization Polyimide
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/91965
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-919652024-11-11T07:26:08Z Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine Wang, W.C. Kang, E.T. Neoh, K.G. CHEMICAL & ENVIRONMENTAL ENGINEERING 4-Vinylpyridine Adhesion Copper Electroless plating Plasma polymerization Polyimide 10.1016/S0169-4332(02)00473-7 Applied Surface Science 199 1-4 52-56 ASUSE 2014-10-09T09:53:17Z 2014-10-09T09:53:17Z 2002-10-30 Article Wang, W.C.,Kang, E.T.,Neoh, K.G. (2002-10-30). Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Applied Surface Science 199 (1-4) : 52-56. ScholarBank@NUS Repository. <a href="https://doi.org/10.1016/S0169-4332(02)00473-7" target="_blank">https://doi.org/10.1016/S0169-4332(02)00473-7</a> 01694332 http://scholarbank.nus.edu.sg/handle/10635/91965 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	4-Vinylpyridine Adhesion Copper Electroless plating Plasma polymerization Polyimide
spellingShingle	4-Vinylpyridine Adhesion Copper Electroless plating Plasma polymerization Polyimide Wang, W.C. Kang, E.T. Neoh, K.G. Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
description	10.1016/S0169-4332(02)00473-7
author2	CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet	CHEMICAL & ENVIRONMENTAL ENGINEERING Wang, W.C. Kang, E.T. Neoh, K.G.
format	Article
author	Wang, W.C. Kang, E.T. Neoh, K.G.
author_sort	Wang, W.C.
title	Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
title_short	Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
title_full	Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
title_fullStr	Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
title_full_unstemmed	Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
title_sort	electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/91965
_version_	1821206929478778880

Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine

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