Criterion for predicting delamination in plastic IC packages

Annual Proceedings - Reliability Physics (Symposium)

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Bibliographic Details
Main Authors:	Tay, A.A.O., Tan, G.L., Lim, T.B.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/92824
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-928242015-01-13T18:36:40Z Criterion for predicting delamination in plastic IC packages Tay, A.A.O. Tan, G.L. Lim, T.B. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING Annual Proceedings - Reliability Physics (Symposium) 236-243 ARLPB 2014-10-16T03:08:53Z 2014-10-16T03:08:53Z 1993 Conference Paper Tay, A.A.O.,Tan, G.L.,Lim, T.B. (1993). Criterion for predicting delamination in plastic IC packages. Annual Proceedings - Reliability Physics (Symposium) : 236-243. ScholarBank@NUS Repository. 0780307828 00999512 http://scholarbank.nus.edu.sg/handle/10635/92824 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Annual Proceedings - Reliability Physics (Symposium)
author2	INSTITUTE OF MICROELECTRONICS
author_facet	INSTITUTE OF MICROELECTRONICS Tay, A.A.O. Tan, G.L. Lim, T.B.
format	Conference or Workshop Item
author	Tay, A.A.O. Tan, G.L. Lim, T.B.
spellingShingle	Tay, A.A.O. Tan, G.L. Lim, T.B. Criterion for predicting delamination in plastic IC packages
author_sort	Tay, A.A.O.
title	Criterion for predicting delamination in plastic IC packages
title_short	Criterion for predicting delamination in plastic IC packages
title_full	Criterion for predicting delamination in plastic IC packages
title_fullStr	Criterion for predicting delamination in plastic IC packages
title_full_unstemmed	Criterion for predicting delamination in plastic IC packages
title_sort	criterion for predicting delamination in plastic ic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/92824
_version_	1681091005907992576

Criterion for predicting delamination in plastic IC packages

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