Criterion for predicting delamination in plastic IC packages
Annual Proceedings - Reliability Physics (Symposium)
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Main Authors: | Tay, A.A.O., Tan, G.L., Lim, T.B. |
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Other Authors: | INSTITUTE OF MICROELECTRONICS |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/92824 |
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Institution: | National University of Singapore |
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