Propagation of interface edge cracks by mechanical and thermal strains

Propagation of interface edge cracks by mechanical and thermal strains

American Society of Mechanical Engineers, EEP

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Bibliographic Details
Main Authors: Hin Wong, W., Cheng, L., Zhang, Y.-W.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/92831
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/92831

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