Propagation of interface edge cracks by mechanical and thermal strains

American Society of Mechanical Engineers, EEP

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Bibliographic Details
Main Authors: Hin Wong, W., Cheng, L., Zhang, Y.-W.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/92831
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-928312015-01-16T07:00:02Z Propagation of interface edge cracks by mechanical and thermal strains Hin Wong, W. Cheng, L. Zhang, Y.-W. MECHANICAL & PRODUCTION ENGINEERING American Society of Mechanical Engineers, EEP 26 2/- EEAEE 2014-10-16T03:08:57Z 2014-10-16T03:08:57Z 1999 Conference Paper Hin Wong, W.,Cheng, L.,Zhang, Y.-W. (1999). Propagation of interface edge cracks by mechanical and thermal strains. American Society of Mechanical Engineers, EEP 26 : 2/-. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/92831 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description American Society of Mechanical Engineers, EEP
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
Hin Wong, W.
Cheng, L.
Zhang, Y.-W.
format Conference or Workshop Item
author Hin Wong, W.
Cheng, L.
Zhang, Y.-W.
spellingShingle Hin Wong, W.
Cheng, L.
Zhang, Y.-W.
Propagation of interface edge cracks by mechanical and thermal strains
author_sort Hin Wong, W.
title Propagation of interface edge cracks by mechanical and thermal strains
title_short Propagation of interface edge cracks by mechanical and thermal strains
title_full Propagation of interface edge cracks by mechanical and thermal strains
title_fullStr Propagation of interface edge cracks by mechanical and thermal strains
title_full_unstemmed Propagation of interface edge cracks by mechanical and thermal strains
title_sort propagation of interface edge cracks by mechanical and thermal strains
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/92831
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