Propagation of interface edge cracks by mechanical and thermal strains
American Society of Mechanical Engineers, EEP
Saved in:
Main Authors: | Hin Wong, W., Cheng, L., Zhang, Y.-W. |
---|---|
Other Authors: | MECHANICAL & PRODUCTION ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/92831 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Comparative study on crack initiation and propagation of glass under thermal loading
by: Wang, Y, et al.
Published: (2020) -
Crack propagation mechanism in rounded cohesive granular media
by: I. Preechawuttipong, et al.
Published: (2018) -
Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
by: Seah, S.K.W., et al.
Published: (2014) -
Fracture mechanics investigation on interface crack kinking
by: Toh, Benjamin Choon How
Published: (2014) -
Crack initiation and propagation in pre-cracked rock specimens
by: Cai, Xiao
Published: (2015)