Thermal stability of strained Si/Si1-xGex heterostructures for advanced microelectronics devices

Thermal stability of strained Si/Si1-xGex heterostructures for advanced microelectronics devices

10.1016/j.tsf.2004.05.050

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Bibliographic Details
Main Authors: Wong, L.H., Wong, C.C., Ong, K.K., Liu, J.P., Chan, L., Rao, R., Pey, K.L., Liu, L., Shen, Z.X.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Raman
Silicon germanium
Strained silicon
Thermal stability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/98370
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Institution: National University of Singapore
Description
Summary:10.1016/j.tsf.2004.05.050

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