Integration of MEMS with RFID

by Chua, Shen Lin.
Published 2012

Direct metal to metal bonding method for heterogenous 3D integration

by Chua, Shen Lin
Published 2020

Cu-Cu bonding in ambient environment by Ar/N 2 plasma surface activation and its characterization

by Chua, Shen Lin, Chan, Marvin Jiawei, Goh, Simon Chun Kiat, Tan, Chuan Seng
Published 2020

Geometry and thermal stress analysis of in-plane outgassing channels in Al2O3-intermediated InP (die)-to-Si (wafer) bonding

by Lin, Yiding, Anantha, P., Lee, Kwang Hong, Chua, Shen Lin, Shang, Lingru, Tan, Chuan Seng
Published 2019

Growth and fabrication of carbon-based three-dimensional heterostructure in through-silicon vias (TSVs) for 3D interconnects

by Zhu, Ye, Tan, Chong Wei, Chua, Shen Lin, Lim, Yu Dian, Tay, Beng Kang, Tan, Chuan Seng
Published 2021

Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects

by Zhu, Ye, Tan, Chong Wei, Chua, Shen Lin, Lim, Yu Dian, Vaisband, Boris, Tay, Beng Kang, Friedman, Eby G., Tan, Chuan Seng
Published 2021