Direct metal to metal bonding method for heterogenous 3D integration
Metal-based bonding will create vertical electrical connections between the dies and simultaneously create strong mechanical strength and hermetic sealing allowing heterogeneous 3D integration and 3D packaging. In this study, Cu-Cu fusion bonding with plasma surface modification and Al-Au thermoc...
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| Format: | Thesis-Doctor of Philosophy |
| Language: | English |
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Nanyang Technological University
2020
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| Online Access: | https://hdl.handle.net/10356/143627 |
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| Institution: | Nanyang Technological University |
| Language: | English |