Direct metal to metal bonding method for heterogenous 3D integration

• Main Author: Chua, Shen Lin
• Other Authors: Tan, Chuan Seng
• Format: Thesis-Doctor of Philosophy
• Language: English
• Published: Nanyang Technological University 2020
• Subjects: Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/143627
• Institution: Nanyang Technological University

Metal-based bonding will create vertical electrical connections between the dies and simultaneously create strong mechanical strength and hermetic sealing allowing heterogeneous 3D integration and 3D packaging. In this study, Cu-Cu fusion bonding with plasma surface modification and Al-Au thermoc...