Fracture toughness measurement of thin films on compliant substrate using controlled buckling test

بواسطة Chen, Zhong, Gan, Zhenghao
منشور في 2012

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

بواسطة Tan, Cher Ming, Gan, Zhenghao
منشور في 2009

Nondestructive void size determination in copper metallization under passivation

بواسطة Gan, Zhenghao, Tan, Cher Ming, Zhang, Guan
منشور في 2009

Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects

بواسطة Tan, Cher Ming, Zhang, Guan, Gan, Zhenghao
منشور في 2009

Temperature and stress distribution in the SOI structure during fabrication

بواسطة Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang
منشور في 2009

Applications of finite element methods for reliability study of ULSI interconnections

بواسطة Tan, Cher Ming, Li, Wei, Gan, Zhenghao
منشور في 2013

Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

بواسطة Prasad, K., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Zhang, Sam, Chen, Zhe
منشور في 2012

Analytical modeling of reservoir effect on electromigration in Cu interconnects

بواسطة Zaporozhets, T., Tu, K. N., Gusak, A. M., Shao, W., Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
منشور في 2012

Modification of Ta/polymeric low-k interface by electron beam treatment

بواسطة Prasad, K., Damayanti, M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Chen, Zhe, Zhang, Sam, Jiang, Ning
منشور في 2012

Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface

بواسطة Damayanti, M., Prasad, K., Chen, Zhe, Zhang, Sam, Jiang, Ning, Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
منشور في 2012

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects

بواسطة Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu
منشور في 2012