A miniaturized lamellar grating based Fourier transform spectrometer with electrostatic actuation

by Shouhua, W., Hongbin, Y., Siong, C.F.
Published 2014

Expression of telomeric repeat binding factor 2 (Terf2) in childhood acute lymphoblastic leukemia

by Vengidasan, L., Sin, C.S., Siong, C.K., Ibrahim, Kamariah
Published 2021

Simple method for fabricating solid microlenses with different focal lengths

by Hongbin, Y., Guangya, Z., Siong, C.F., Feiwen, L.
Published 2014

A variable optical attenuator based on optofluidic technology

by Hongbin, Y., Guangya, Z., Siong, C.F., Feiwen, L.
Published 2014

Lens with transformable-type and tunable-focal-length characteristics

by Hongbin, Y., Guangya, Z., Siong, C.F., Shouhua, W.
Published 2014

Multi degree-of-freedom micromotor utilizing an electrothermal actuator array and a spherical rotor

by Mu, X., Sun, W., Feng, H., Zhou, G., Siong, C.F.
Published 2014

Novel polydimethylsiloxane (PDMS) based microchannel fabrication method for lab-on-a-chip application

by Hongbin, Y., Guangya, Z., Siong, C.F., Shouhua, W., Feiwen, L.
Published 2014

New methodology for mechanical characterisation of solders for IC packaging

by Lok, T.S., Siong, C.F., Kuan, L.B., Hua, W.E.
Published 2014

A tunable Shack-Hartmann wavefront sensor based on a liquid-filled microlens array

by Hongbin, Y., Guangya, Z., Siong, C.F., Feiwen, L., Shouhua, W.
Published 2014

Geotechnical properties of unprocessed soil from abandoned Mamut mine in Sabah, Borneo

by Makinda, J., Kassim, K. A., Siong, C. C., Zango, M. U., Muhammed, A. S.
Published 2021

An electromagnetically driven lamellar grating based Fourier transform microspectrometer

by Hongbin, Y., Guangya, Z., Siong, C.F., Feiwen, L., Shouhua, W., Mingsheng, Z.
Published 2014

The implementation of a visual language interface for an object-oriented multimedia database system

by Mun-Kew, L., Boon-Siong, C., Chun-Hong, K., Jyh-Jang, L., Narasimhalu, D.
Published 2014

Design of an on-chip Fourier transform spectrometer using waveguide directional couplers and NEMS

by Liang, L., Chenyu, P., Yi, Q., Guangcan, Z., Qifeng, Q., Fook Siong, C., Guangya, Z.
Published 2021

C45 ultra low k wafer technology with Cu wire bonding

by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.
Published 2023

Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology

by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.
Published 2023