Effects of copper diffusion on the performance of MOS devices

by Tee, Kheng Chok.
Published 2008

Formation of air gap structures for inter-metal dielectric application

by SOO, CHOI PHENG, TEE, KHENG CHOK, ONG, KOK KENG, CHAN, LAP
Published 2012

Passivation of copper interconnect surfaces with a passivating metal layer

by CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
Published 2012

Passivation of copper interconnect surfaces with a passivating metal layer

by CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
Published 2012

Robust electromigration reliability through engineering optimization

by Tee, Kheng Chok, Ee, Yong Chiang, Aubel, Oliver, Pey, Kin Leong, Ng, Wee Loon, Liu, Junfeng, Tan, Chuan Seng
Published 2014