Passivation of copper interconnect surfaces with a passivating metal layer

Passivation of copper interconnect surfaces with a passivating metal layer

US6100195

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Bibliographic Details
Main Authors: CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32579
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/32579

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