Passivation of copper interconnect surfaces with a passivating metal layer

US6100195

Saved in:
Bibliographic Details
Main Authors: CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32579
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-32579
record_format dspace
spelling sg-nus-scholar.10635-325792015-07-29T07:03:41Z Passivation of copper interconnect surfaces with a passivating metal layer CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON INSTITUTE OF MICROELECTRONICS CHARTERED SEMICONDUCTOR MANU. LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) NAHYANG TECHN. UNIV. OF SINGAPORE (SINGAPORE, SG) INSTITUTE OF MICROELECTRONICS US6100195 Granted Patent 2012-05-02T02:27:19Z 2012-05-02T02:27:19Z 2000-08-08 Patent CHAN, LAP,YAP, KUAN PEI,TEE, KHENG CHOK,IP, FLORA S.,LOH, WYE BOON (2000-08-08). Passivation of copper interconnect surfaces with a passivating metal layer. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32579 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description US6100195
author2 INSTITUTE OF MICROELECTRONICS
author_facet INSTITUTE OF MICROELECTRONICS
CHAN, LAP
YAP, KUAN PEI
TEE, KHENG CHOK
IP, FLORA S.
LOH, WYE BOON
format Patent
author CHAN, LAP
YAP, KUAN PEI
TEE, KHENG CHOK
IP, FLORA S.
LOH, WYE BOON
spellingShingle CHAN, LAP
YAP, KUAN PEI
TEE, KHENG CHOK
IP, FLORA S.
LOH, WYE BOON
Passivation of copper interconnect surfaces with a passivating metal layer
author_sort CHAN, LAP
title Passivation of copper interconnect surfaces with a passivating metal layer
title_short Passivation of copper interconnect surfaces with a passivating metal layer
title_full Passivation of copper interconnect surfaces with a passivating metal layer
title_fullStr Passivation of copper interconnect surfaces with a passivating metal layer
title_full_unstemmed Passivation of copper interconnect surfaces with a passivating metal layer
title_sort passivation of copper interconnect surfaces with a passivating metal layer
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/32579
_version_ 1681081249220788224