Passivation of copper interconnect surfaces with a passivating metal layer
US6100195
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2012
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sg-nus-scholar.10635-325792015-07-29T07:03:41Z Passivation of copper interconnect surfaces with a passivating metal layer CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON INSTITUTE OF MICROELECTRONICS CHARTERED SEMICONDUCTOR MANU. LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) NAHYANG TECHN. UNIV. OF SINGAPORE (SINGAPORE, SG) INSTITUTE OF MICROELECTRONICS US6100195 Granted Patent 2012-05-02T02:27:19Z 2012-05-02T02:27:19Z 2000-08-08 Patent CHAN, LAP,YAP, KUAN PEI,TEE, KHENG CHOK,IP, FLORA S.,LOH, WYE BOON (2000-08-08). Passivation of copper interconnect surfaces with a passivating metal layer. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32579 NOT_IN_WOS PatSnap |
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US6100195 |
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INSTITUTE OF MICROELECTRONICS |
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INSTITUTE OF MICROELECTRONICS CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON |
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Patent |
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CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON |
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CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON Passivation of copper interconnect surfaces with a passivating metal layer |
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CHAN, LAP |
title |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_short |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_full |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_fullStr |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_full_unstemmed |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_sort |
passivation of copper interconnect surfaces with a passivating metal layer |
publishDate |
2012 |
url |
http://scholarbank.nus.edu.sg/handle/10635/32579 |
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1681081249220788224 |