TEKNIK WAFER BONDING DAN ETSA SELEKTIF DALAM FABRIKASI WAFER SOI
<b>ABSTRACK:</br></b><br /> <p align=\"justify\">Wafer bonding process have been done to support SOI wafer fabrication especially in ELTRAN and SMARTCUT methods, The good quality of wafer bonding was yield by using electrostatic forces (stress >2x105 N/m- )...
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| Format: | Theses |
| Language: | Indonesia |
| Online Access: | https://digilib.itb.ac.id/gdl/view/1692 |
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| Institution: | Institut Teknologi Bandung |
| Language: | Indonesia |
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