DESIGN AND IMPLEMENTATION OF INSTRUMENTATION SYSTEMS ON ROTATING ANALYZER ELLIPSOMETER

• Main Author: Yusron Muttaqin, Muchammad
• Format: Final Project
• Language: Indonesia
• Online Access: https://digilib.itb.ac.id/gdl/view/37032
• Institution: Institut Teknologi Bandung

In the semiconductor industry, the thickness of the photoresist layer when the photolithograph process plays an important role in determining a failure in IC manufacturing. The thickness of this layer is important because, at the stage of addition of doping ions, a photoresist that is too thin will result in the grinding of areas not exposed to doping or vice versa. The above problems occur due to several factors, one of which is the thickness of the photoresist. The thickness that does not meet the IC manufacturing process specifications will result in wafers that are processed by lithography that may fail and must be discarded. From the explanation, the photoresist thickness measurement system with the RAE concept can be one solution to solve the problem In designing the photoresist thickness measurement system an Instrumentation system is needed. In the system, there is a signal conditioning system to forward physical signals to digital signals so that they can be received by signal processing devices. In designing and implementing this system using a photodiode sensor to capture physical signals in the form of light intensity signals and then forwarded by a signal conditioning circuit to be translated in the form of analog signals. The design of the photoresist thin layer thickness drilling system using the Rotating-Analyzer Ellipsometer (RAE) concept In addition to the signal conditioning circuit the important part is the laser driver circuit, motor driver, and power supply circuit.