Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
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Trans Tech Publications
2014
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my.unimap-336562014-04-13T04:18:07Z Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Aaron, Koay Terr Yeow Siew Chui, Goh Khairul Anwar, Mohamad Khazali Nooraihan, Abdullah zaliman@unimap.edu.my DOE Platinum Reactive Ion Etching (RIE) SF₆+Argon Surface roughness Link to publisher's homepage at http://www.ttp.net/ This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process variables, with 8 sets of experiments were scrutinized using a systematically designed design of experiment (DOE). The three variables in the investigation are ICP power, Bias power, and working pressure. The estimate of the effect calculated for ICP power, Bias power, and working pressure are-4.9288, -6.2383, and-4.7223 respectively. All three factors gave negative effects. This implies that the surface roughness decreases when ICP power, Bias power, and working pressure is high. The Bias Power is the most influential factor followed by ICP Power, and working pressure. 2014-04-13T04:18:07Z 2014-04-13T04:18:07Z 2014 Article Applied Mechanics and Materials, vol.487, 2014, pages 210-213 1662-7482 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33656 http://www.scientific.net/AMM.487.210 10.4028/www.scientific.net/AMM.487.210 en Trans Tech Publications |
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DOE Platinum Reactive Ion Etching (RIE) SF₆+Argon Surface roughness |
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DOE Platinum Reactive Ion Etching (RIE) SF₆+Argon Surface roughness Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Aaron, Koay Terr Yeow Siew Chui, Goh Khairul Anwar, Mohamad Khazali Nooraihan, Abdullah Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
zaliman@unimap.edu.my |
| author_facet |
zaliman@unimap.edu.my Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Aaron, Koay Terr Yeow Siew Chui, Goh Khairul Anwar, Mohamad Khazali Nooraihan, Abdullah |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Aaron, Koay Terr Yeow Siew Chui, Goh Khairul Anwar, Mohamad Khazali Nooraihan, Abdullah |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous |
| title_short |
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous |
| title_full |
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous |
| title_fullStr |
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous |
| title_full_unstemmed |
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous |
| title_sort |
investigation of surface roughness on platinum deposited wafer after reactive ion etching using sf₆+argon gaseous |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33656 |
| _version_ |
1643797243057143808 |