C45 ultra low k wafer technology with Cu wire bonding
As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonde...
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my.uniten.dspace-305752024-04-18T10:01:20Z C45 ultra low k wafer technology with Cu wire bonding Leng E.P. Siong C.T. Seong L.B. Leong P. Gunasekaran Song J. Mock K. Siew C. Sivakumar Kid W.B. Weily C. 26423002500 24725638500 36004755800 37018502900 37018118100 55500876000 37018607700 37018745500 37018804400 36992192300 36992593400 Cost reduction Electric conductivity Industrial electronics Manufacture Technology Wire Bond pad Electrical conductivity Electrical resistivity Gold prices Ultra fine pitch Ultra low-k Wafer technology Wire bonding Wire diameter Wafer bonding As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonded ball hardness are 34% and 60% higher than that of Au, hence increases the stress on bond pad and chip. Although Cu wire price is generally only 5 to 10% of Au wire cost depending on wire diameter, but bonding with a much harder material like Cu requires great characterization effort due to the a much higher level of unknowns and complexities, especially when dealing with ultra fine pitch and ultra low k wafer technology. � 2010 IEEE. Final 2023-12-29T07:49:41Z 2023-12-29T07:49:41Z 2010 Conference Paper 10.1109/IEMT.2010.5746739 2-s2.0-79955771481 https://www.scopus.com/inward/record.uri?eid=2-s2.0-79955771481&doi=10.1109%2fIEMT.2010.5746739&partnerID=40&md5=6edae2fdf5e1d3fe4e112b91c95f80f6 https://irepository.uniten.edu.my/handle/123456789/30575 5746739 Scopus |
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Cost reduction Electric conductivity Industrial electronics Manufacture Technology Wire Bond pad Electrical conductivity Electrical resistivity Gold prices Ultra fine pitch Ultra low-k Wafer technology Wire bonding Wire diameter Wafer bonding |
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Cost reduction Electric conductivity Industrial electronics Manufacture Technology Wire Bond pad Electrical conductivity Electrical resistivity Gold prices Ultra fine pitch Ultra low-k Wafer technology Wire bonding Wire diameter Wafer bonding Leng E.P. Siong C.T. Seong L.B. Leong P. Gunasekaran Song J. Mock K. Siew C. Sivakumar Kid W.B. Weily C. C45 ultra low k wafer technology with Cu wire bonding |
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As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonded ball hardness are 34% and 60% higher than that of Au, hence increases the stress on bond pad and chip. Although Cu wire price is generally only 5 to 10% of Au wire cost depending on wire diameter, but bonding with a much harder material like Cu requires great characterization effort due to the a much higher level of unknowns and complexities, especially when dealing with ultra fine pitch and ultra low k wafer technology. � 2010 IEEE. |
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26423002500 |
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26423002500 Leng E.P. Siong C.T. Seong L.B. Leong P. Gunasekaran Song J. Mock K. Siew C. Sivakumar Kid W.B. Weily C. |
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Conference Paper |
author |
Leng E.P. Siong C.T. Seong L.B. Leong P. Gunasekaran Song J. Mock K. Siew C. Sivakumar Kid W.B. Weily C. |
author_sort |
Leng E.P. |
title |
C45 ultra low k wafer technology with Cu wire bonding |
title_short |
C45 ultra low k wafer technology with Cu wire bonding |
title_full |
C45 ultra low k wafer technology with Cu wire bonding |
title_fullStr |
C45 ultra low k wafer technology with Cu wire bonding |
title_full_unstemmed |
C45 ultra low k wafer technology with Cu wire bonding |
title_sort |
c45 ultra low k wafer technology with cu wire bonding |
publishDate |
2023 |
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1806427353990037504 |