Film bake process— Driving the blister out
Saved in:
Main Author: | Camacho, Drexel H. |
---|---|
Format: | text |
Published: |
Animo Repository
2007
|
Subjects: | |
Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/5710 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | De La Salle University |
Similar Items
-
Layered polymeric composite spacer for stacked chip scale packages
by: Camacho, Drexel H., et al.
Published: (2005) -
Design for manufacturability: Package bulging solution path on folded stacked chip packages (FSCSP) high volume manufacturing
by: Camacho, Drexel H., et al.
Published: (2006) -
Application of screen-printable, thermally conductive, B-stageable folding adhesive for FSCSP
by: Mahinay, Cheryll Lei E., et al.
Published: (2005) -
Surface-Driven High-Pressure Processing
by: Gubbins K.E., et al.
Published: (2019) -
A system study on the Production Department of Williams Commercial Company Inc.
by: Cagampan, Joel Brian M., et al.
Published: (2016)