Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
Dielectric breakdown is a well documented phenomenon studied for logic transistors using SiO2/SiON and HfO2 as the oxide material with thickness ranging from 1-5 nm. Recovery of dielectric breakdown has also been reported recently and its implications on the prolonged time dependent dielectric break...
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sg-ntu-dr.10356-1013212020-03-07T13:24:50Z Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena Pey, Kin Leong Raghavan, Nagarajan Wu, Xing Liu, Wenhu Bosman, Michel School of Electrical and Electronic Engineering IEEE International Conference on Solid-State and Integrated Circuit Technology (11th : 2012 : Xi'an, China) DRNTU::Engineering::Electrical and electronic engineering Dielectric breakdown is a well documented phenomenon studied for logic transistors using SiO2/SiON and HfO2 as the oxide material with thickness ranging from 1-5 nm. Recovery of dielectric breakdown has also been reported recently and its implications on the prolonged time dependent dielectric breakdown (TDDB) lifetime are very significant. Similarly, in the non-volatile memory arena, orders of magnitude change in conductance of the oxide has been observed for different voltage levels, voltage polarities and current densities, which is commonly referred to as “resistive switching”. Interestingly, although the gate stacks used for logic and memory applications are very similar in the materials used and dimensions as well, the mechanisms postulated to explain the breakdown-recovery mechanism in logic and switching mechanism in memory are very different. Often, the mechanism underlying switching tends to be very speculative without any convincing physical and electrical evidence that confirms the underlying kinetics of the reversible conductance state transition process. The issue stems from the fact that researchers in logic and memory operate in two distinct domains and seldom interact with each other and as a result, the link between the devices used for these two applications is not clearly recognized by most scientists. In this study, we will bridge the gap between these two phenomena and take advantage of our understanding of dielectric breakdown and recovery to convincingly explain the fundamental physics governing the switching process. 2013-10-04T06:42:15Z 2019-12-06T20:36:41Z 2013-10-04T06:42:15Z 2019-12-06T20:36:41Z 2012 2012 Conference Paper Pey, K. L., Raghavan, N., Wu, X., Liu, W., & Bosman, M. (2012). Dielectric breakdown — Recovery in logic and resistive switching in memory — Bridging the gap between the two phenomena. 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT). https://hdl.handle.net/10356/101321 http://hdl.handle.net/10220/16275 10.1109/ICSICT.2012.6467690 en |
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DRNTU::Engineering::Electrical and electronic engineering Pey, Kin Leong Raghavan, Nagarajan Wu, Xing Liu, Wenhu Bosman, Michel Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
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Dielectric breakdown is a well documented phenomenon studied for logic transistors using SiO2/SiON and HfO2 as the oxide material with thickness ranging from 1-5 nm. Recovery of dielectric breakdown has also been reported recently and its implications on the prolonged time dependent dielectric breakdown (TDDB) lifetime are very significant. Similarly, in the non-volatile memory arena, orders of magnitude change in conductance of the oxide has been observed for different voltage levels, voltage polarities and current densities, which is commonly referred to as “resistive switching”. Interestingly, although the gate stacks used for logic and memory applications are very similar in the materials used and dimensions as well, the mechanisms postulated to explain the breakdown-recovery mechanism in logic and switching mechanism in memory are very different. Often, the mechanism underlying switching tends to be very speculative without any convincing physical and electrical evidence that confirms the underlying kinetics of the reversible conductance state transition process. The issue stems from the fact that researchers in logic and memory operate in two distinct domains and seldom interact with each other and as a result, the link between the devices used for these two applications is not clearly recognized by most scientists. In this study, we will bridge the gap between these two phenomena and take advantage of our understanding of dielectric breakdown and recovery to convincingly explain the fundamental physics governing the switching process. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Pey, Kin Leong Raghavan, Nagarajan Wu, Xing Liu, Wenhu Bosman, Michel |
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Conference or Workshop Item |
author |
Pey, Kin Leong Raghavan, Nagarajan Wu, Xing Liu, Wenhu Bosman, Michel |
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Pey, Kin Leong |
title |
Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
title_short |
Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
title_full |
Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
title_fullStr |
Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
title_full_unstemmed |
Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
title_sort |
dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena |
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2013 |
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https://hdl.handle.net/10356/101321 http://hdl.handle.net/10220/16275 |
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