Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena

Dielectric breakdown is a well documented phenomenon studied for logic transistors using SiO2/SiON and HfO2 as the oxide material with thickness ranging from 1-5 nm. Recovery of dielectric breakdown has also been reported recently and its implications on the prolonged time dependent dielectric break...

Full description

Saved in:
Bibliographic Details
Main Authors: Pey, Kin Leong, Raghavan, Nagarajan, Wu, Xing, Liu, Wenhu, Bosman, Michel
Other Authors: School of Electrical and Electronic Engineering
Format: Conference or Workshop Item
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/101321
http://hdl.handle.net/10220/16275
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-101321
record_format dspace
spelling sg-ntu-dr.10356-1013212020-03-07T13:24:50Z Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena Pey, Kin Leong Raghavan, Nagarajan Wu, Xing Liu, Wenhu Bosman, Michel School of Electrical and Electronic Engineering IEEE International Conference on Solid-State and Integrated Circuit Technology (11th : 2012 : Xi'an, China) DRNTU::Engineering::Electrical and electronic engineering Dielectric breakdown is a well documented phenomenon studied for logic transistors using SiO2/SiON and HfO2 as the oxide material with thickness ranging from 1-5 nm. Recovery of dielectric breakdown has also been reported recently and its implications on the prolonged time dependent dielectric breakdown (TDDB) lifetime are very significant. Similarly, in the non-volatile memory arena, orders of magnitude change in conductance of the oxide has been observed for different voltage levels, voltage polarities and current densities, which is commonly referred to as “resistive switching”. Interestingly, although the gate stacks used for logic and memory applications are very similar in the materials used and dimensions as well, the mechanisms postulated to explain the breakdown-recovery mechanism in logic and switching mechanism in memory are very different. Often, the mechanism underlying switching tends to be very speculative without any convincing physical and electrical evidence that confirms the underlying kinetics of the reversible conductance state transition process. The issue stems from the fact that researchers in logic and memory operate in two distinct domains and seldom interact with each other and as a result, the link between the devices used for these two applications is not clearly recognized by most scientists. In this study, we will bridge the gap between these two phenomena and take advantage of our understanding of dielectric breakdown and recovery to convincingly explain the fundamental physics governing the switching process. 2013-10-04T06:42:15Z 2019-12-06T20:36:41Z 2013-10-04T06:42:15Z 2019-12-06T20:36:41Z 2012 2012 Conference Paper Pey, K. L., Raghavan, N., Wu, X., Liu, W., & Bosman, M. (2012). Dielectric breakdown — Recovery in logic and resistive switching in memory — Bridging the gap between the two phenomena. 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT). https://hdl.handle.net/10356/101321 http://hdl.handle.net/10220/16275 10.1109/ICSICT.2012.6467690 en
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Pey, Kin Leong
Raghavan, Nagarajan
Wu, Xing
Liu, Wenhu
Bosman, Michel
Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
description Dielectric breakdown is a well documented phenomenon studied for logic transistors using SiO2/SiON and HfO2 as the oxide material with thickness ranging from 1-5 nm. Recovery of dielectric breakdown has also been reported recently and its implications on the prolonged time dependent dielectric breakdown (TDDB) lifetime are very significant. Similarly, in the non-volatile memory arena, orders of magnitude change in conductance of the oxide has been observed for different voltage levels, voltage polarities and current densities, which is commonly referred to as “resistive switching”. Interestingly, although the gate stacks used for logic and memory applications are very similar in the materials used and dimensions as well, the mechanisms postulated to explain the breakdown-recovery mechanism in logic and switching mechanism in memory are very different. Often, the mechanism underlying switching tends to be very speculative without any convincing physical and electrical evidence that confirms the underlying kinetics of the reversible conductance state transition process. The issue stems from the fact that researchers in logic and memory operate in two distinct domains and seldom interact with each other and as a result, the link between the devices used for these two applications is not clearly recognized by most scientists. In this study, we will bridge the gap between these two phenomena and take advantage of our understanding of dielectric breakdown and recovery to convincingly explain the fundamental physics governing the switching process.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Pey, Kin Leong
Raghavan, Nagarajan
Wu, Xing
Liu, Wenhu
Bosman, Michel
format Conference or Workshop Item
author Pey, Kin Leong
Raghavan, Nagarajan
Wu, Xing
Liu, Wenhu
Bosman, Michel
author_sort Pey, Kin Leong
title Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
title_short Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
title_full Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
title_fullStr Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
title_full_unstemmed Dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
title_sort dielectric breakdown - recovery in logic and resistive switching in memory : bridging the gap between the two phenomena
publishDate 2013
url https://hdl.handle.net/10356/101321
http://hdl.handle.net/10220/16275
_version_ 1681046505325068288