Thermal analysis of high-powered devices using analytical and experimental methods

Thermal characterization of high power microwave devices is important for determining their reliability. Exceeding the optimal temperature will have a detrimental effect on the performance and reliability of these devices. An accurate closed form analytical solution for predicting the channel temper...

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Bibliographic Details
Main Authors: Ling, Joyce H. L., Tay, Andrew A. O., Choo, Kok Fah
Other Authors: International Conference on Electronic Packaging Technology and High Density Packaging (13th : 2012 : Guilin)
Format: Conference or Workshop Item
Language:English
Published: 2013
Online Access:https://hdl.handle.net/10356/101339
http://hdl.handle.net/10220/16272
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Institution: Nanyang Technological University
Language: English

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