Thermal analysis of high-powered devices using analytical and experimental methods
Thermal characterization of high power microwave devices is important for determining their reliability. Exceeding the optimal temperature will have a detrimental effect on the performance and reliability of these devices. An accurate closed form analytical solution for predicting the channel temper...
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Main Authors: | Ling, Joyce H. L., Tay, Andrew A. O., Choo, Kok Fah |
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Other Authors: | International Conference on Electronic Packaging Technology and High Density Packaging (13th : 2012 : Guilin) |
Format: | Conference or Workshop Item |
Language: | English |
Published: |
2013
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Online Access: | https://hdl.handle.net/10356/101339 http://hdl.handle.net/10220/16272 |
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Institution: | Nanyang Technological University |
Language: | English |
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