Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation

The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni3P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 w...

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Main Authors: Yang, Ying, Balaraju, J. N., Huang, Yizhong, Tay, Yee Yan, Shen, Yiqiang, Tsakadze, Zviad, Chen, Zhong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2014
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Online Access:https://hdl.handle.net/10356/102898
http://hdl.handle.net/10220/24285
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1028982023-07-14T15:51:00Z Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation Yang, Ying Balaraju, J. N. Huang, Yizhong Tay, Yee Yan Shen, Yiqiang Tsakadze, Zviad Chen, Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials::Electronic packaging materials The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni3P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 wt.% Sn) was developed to replace Ni–P. The interfacial microstructure of electroless Ni–Sn–P/Sn–3.5Ag solder joints was investigated after reflow and solid-state aging. For comparison, the interfacial reaction in electroless Ni–P/Sn–3.5Ag solder joints under the same reflow and aging conditions was studied. It was found that the Ni–Sn–P metallization is consumed much more slowly than the Ni–P metallization during soldering. After prolonged reaction, no Ni3P or voids are observed under SEM at the Ni–Sn–P/Sn–3.5Ag interface. Two main intermetallic compounds, Ni3Sn4 and Ni13Sn8P3, are formed during the soldering reaction. The reason for Ni3P phase suppression and the overall mechanisms of reaction at the Ni–Sn–P/Sn–3.5Ag interface are discussed. Accepted version 2014-12-02T07:52:36Z 2019-12-06T21:01:57Z 2014-12-02T07:52:36Z 2019-12-06T21:01:57Z 2014 2014 Journal Article Yang, Y., Balaraju, J. N., Huang, Y., Tay, Y. Y., Shen, Y., Tsakadze, Z., et al. (2014). Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation. Journal of electronic materials, 43(11), 4103-4110. https://hdl.handle.net/10356/102898 http://hdl.handle.net/10220/24285 10.1007/s11664-014-3306-z en Journal of electronic materials © 2014 The Minerals, Metals and Materials Society. This is the author created version of a work that has been peer reviewed and accepted for publication in Journal of Electronic Materials, published by Springer on behalf of The Minerals, Metals and Materials Society.  It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1007/s11664-014-3306-z]. 20 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials::Electronic packaging materials
spellingShingle DRNTU::Engineering::Materials::Electronic packaging materials
Yang, Ying
Balaraju, J. N.
Huang, Yizhong
Tay, Yee Yan
Shen, Yiqiang
Tsakadze, Zviad
Chen, Zhong
Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
description The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni3P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 wt.% Sn) was developed to replace Ni–P. The interfacial microstructure of electroless Ni–Sn–P/Sn–3.5Ag solder joints was investigated after reflow and solid-state aging. For comparison, the interfacial reaction in electroless Ni–P/Sn–3.5Ag solder joints under the same reflow and aging conditions was studied. It was found that the Ni–Sn–P metallization is consumed much more slowly than the Ni–P metallization during soldering. After prolonged reaction, no Ni3P or voids are observed under SEM at the Ni–Sn–P/Sn–3.5Ag interface. Two main intermetallic compounds, Ni3Sn4 and Ni13Sn8P3, are formed during the soldering reaction. The reason for Ni3P phase suppression and the overall mechanisms of reaction at the Ni–Sn–P/Sn–3.5Ag interface are discussed.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Yang, Ying
Balaraju, J. N.
Huang, Yizhong
Tay, Yee Yan
Shen, Yiqiang
Tsakadze, Zviad
Chen, Zhong
format Article
author Yang, Ying
Balaraju, J. N.
Huang, Yizhong
Tay, Yee Yan
Shen, Yiqiang
Tsakadze, Zviad
Chen, Zhong
author_sort Yang, Ying
title Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
title_short Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
title_full Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
title_fullStr Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
title_full_unstemmed Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation
title_sort interface reaction between electroless ni–sn–p metallization and lead-free sn–3.5ag solder with suppressed ni3p formation
publishDate 2014
url https://hdl.handle.net/10356/102898
http://hdl.handle.net/10220/24285
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