Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation

The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni3P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 w...

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Bibliographic Details
Main Authors: Yang, Ying, Balaraju, J. N., Huang, Yizhong, Tay, Yee Yan, Shen, Yiqiang, Tsakadze, Zviad, Chen, Zhong
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2014
Subjects:
Online Access:https://hdl.handle.net/10356/102898
http://hdl.handle.net/10220/24285
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Institution: Nanyang Technological University
Language: English

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