Robust electromigration reliability through engineering optimization

• Main Authors: Tee, Kheng Chok, Ee, Yong Chiang, Aubel, Oliver, Pey, Kin Leong, Ng, Wee Loon, Liu, Junfeng, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: https://hdl.handle.net/10356/103452; http://hdl.handle.net/10220/24506
• Institution: Nanyang Technological University

With complex process integration approach and severe fabrication limitations caused by introduction of new materials and diminishing process margins, there are mounting concerns with the increased failure rate at the early life cycle (e.g.<1 year operation) of product application known as infant...