Laser focus depth adaptation for decapsulation of copper wirebonded devices
Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFP...
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sg-ntu-dr.10356-1073182020-09-26T22:15:34Z Laser focus depth adaptation for decapsulation of copper wirebonded devices Kor, Katherine Hwee Boon Liu, Qing Siah, Yu Wen Gan, Chee Lip School of Materials Science & Engineering 40th International Symposium for Testing and Failure Analysis Temasek Laboratories DRNTU::Engineering::Materials::Metallic materials Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%. Published version 2015-04-08T07:50:49Z 2019-12-06T22:28:49Z 2015-04-08T07:50:49Z 2019-12-06T22:28:49Z 2014 2014 Conference Paper Kor, H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2014). Laser focus depth adaptation for decapsulation of copper wirebonded devices. Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 94-99. https://hdl.handle.net/10356/107318 http://hdl.handle.net/10220/25336 http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices 184396 en © 2014 ASM International. This paper was published in Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis and is made available as an electronic reprint (preprint) with permission of ASM International. The paper can be found at the following official URL: [http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law. 6 p. application/pdf |
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DRNTU::Engineering::Materials::Metallic materials Kor, Katherine Hwee Boon Liu, Qing Siah, Yu Wen Gan, Chee Lip Laser focus depth adaptation for decapsulation of copper wirebonded devices |
description |
Although pre-laser decapsulation reduces the time to acid
exposure for subsequent chemical decapsulation of copper
wirebonded devices, it can result in severely damaged or
broken copper wirebonds if carried out at a focused depth
followed by chemical decapsulation. Thin quad flat packages
(TQFPs) of dimensions 22 mm × 22 mm, with copper
wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm)
at three depths of focus, at focus, (z-0.5) mm and (z-1) mm.
Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in
copper wirebond diameter after complete (laser and chemical)
decapsulation is about 2.30%. |
author2 |
School of Materials Science & Engineering |
author_facet |
School of Materials Science & Engineering Kor, Katherine Hwee Boon Liu, Qing Siah, Yu Wen Gan, Chee Lip |
format |
Conference or Workshop Item |
author |
Kor, Katherine Hwee Boon Liu, Qing Siah, Yu Wen Gan, Chee Lip |
author_sort |
Kor, Katherine Hwee Boon |
title |
Laser focus depth adaptation for decapsulation of copper wirebonded devices |
title_short |
Laser focus depth adaptation for decapsulation of copper wirebonded devices |
title_full |
Laser focus depth adaptation for decapsulation of copper wirebonded devices |
title_fullStr |
Laser focus depth adaptation for decapsulation of copper wirebonded devices |
title_full_unstemmed |
Laser focus depth adaptation for decapsulation of copper wirebonded devices |
title_sort |
laser focus depth adaptation for decapsulation of copper wirebonded devices |
publishDate |
2015 |
url |
https://hdl.handle.net/10356/107318 http://hdl.handle.net/10220/25336 http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices |
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